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Category
Primary
technology-and-computing · embed-ft 0.28
Tree path
Technology & Computing
Group (tier-1)
Also (top-3)
Tech stack
AI readiness
Compliance (GEO / GDPR)
TLD
Overview
Title
晶通（高邮）集成电路有限公司-提供晶圆级扇出型先进封装的整体方案
Description
晶通（高邮）集成电路有限公司 晶通科技是国内领先的以晶圆级扇出型fan-out先进封装技术为平台的Chiplet integration方案提供商。主要从事Chiplet Integration小芯片系统集成与FOSiP晶圆级扇出型封装相关的设计仿真、封装测试,为客户提供一站式解决方案。
Final URL
Language
zh (html)
Scanned at
2026-06-24 20:00:43