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manufacturing-industry · embed-ft 0.65
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Business and Finance › Industries › Manufacturing Industry
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Overview
Title
Wafer Grinder,CMP and Edge Grinding equipment for Semiconductor-TengYu
Description
Wafer Grinder,CMP and Edge Grinding equipment are compatible with 4/6/8/12-inch wafers, with TTV ≤ 2μm and a maximum roughness of 0.2nm!
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Language
en (content)
Scanned at
2026-06-24 01:34:16