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Primary
computing · embed-ft 0.29
Tree path
Technology & Computing › Computing
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Also (top-3)
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CMS
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AI readiness
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Overview
Title
Novel Dielectric Materials for IC Packaging and High Speed PCBs
Description
Novel Next-Generation Ultralow Loss High Thermomechanical Reliability Dielectric Materials for Advanced IC Packaging & Ultra High Speed PCBs
Final URL
Language
en (html)
Scanned at
2026-06-29 06:21:11