we provide solutions for ceramic metalization process design and processing We specialize in the manufacturing of small-format DPC (Direct Plated Copper) ceramic substrates, with dimensions up to 10x10mm and a thickness of under 0.6mm. Utilizing materials such as aluminum nitride (AlN) and alumina (Al2O3), our process is ideally suited for your micro thermoelectric Peltier modules. We ensure reliable quality and stable delivery cycles, making us a strong and dependable partner for your needs.